At the 5G Summit Qualcomm released a new system on a chip (SoC) called Snapdragon 778G. Positioned as a “bridge” between the HP flagship chip and the high-end midrange. The Snapdragon 778G has similarities with the Snapdragon 780G SoC.
“The Snapdragon 778G was developed to meet the growing demand from global OEMs to provide a wider choice of platforms at high-tiers,” said Kedar Kondap, Vice President of Product Management, Qualcomm. Snapdragon 778G brings many of the latest premium technologies and high-tier features to support the next generation of more experiences and access.
The difference between the 778G and the 780G is the chip manufacturing. The 778G is made with a 6nm fabrication. While the 780G is made with manufacturing 5nm. Possibly done to solve the problem of global chip scarcity. The Kyro 670 CPU core is claimed to have an increase of up to 40% in overall CPU performance and the Adreno 642L GPU is designed to deliver the promised graphics rendering process up to 40% faster than the previous generation.
The Snapdragon 778G is equipped with the Spectra 570 triple ISP, the same as the 780G. This image processing system can process images from 3 cameras simultaneously, both for photos and videos. Cell Phones using the 778G can record 4K HDR10 + video with enhanced color, contrast, and detail. Meanwhile, the AI sector is handed over to the Hexagon 770 processor which has TOP 12 computing capabilities.
Then with the integrated Snapdragon X53 5G modem. HP that uses the 778G can use both mmWave and sub-6 5G connections. Meanwhile, the FastConnect 6700 Connectivity System makes it capable of WiFi 6 (up to 2.9Gbps) and Bluetooth 5.2. Manufacturers such as Honor, iQOO, Motorola, Oppo, Realme, and Xiaomi are slated to release the HP with the 778G in Q2 2021.